Designed for the assembly of difficult-to-bond materials that require uniform stress distribution. Particularly suited for bonding porous or absorbent materials. Also formulated for faster cure speeds on dry or acidic surfaces and substrates.
Gap fill: 0.010"
Temperature range: 65°F to +180°F (54°C to +82°C)
Cure speed: Fixture 15 sec.; Full 24 hrs.